• Track 1
  • November 4, Thursday | 8:30A.M.~5:25 P.M., Room Monterosso, B1F
  • Track 2
  • November 4, Thursday | 8:30 A.M.~5:25 P.M., Room Forum1, 3F

  • Track 1
  • November 5, Friday | 8:30A.M.~6:00 P.M., Room Monterosso, B1F
  • Track 2
  • November 5, Friday | 8:30 A.M.~6:00 P.M., Room Forum1, 3FF


Plenary Speaker
November 4, Thursday | 1:20~1:50 P.M.
Hanwha Resort, Room Monterosso, B1F


Title: Semiconductor Industry Savior: Further Acceleration in Package Innovation

Dr. Yun Tae Lee, Former CEO
Samsung Electro-Mechanics Co., Ltd., Korea
November 4, Thursday | 1:50~2:20 P.M.
Hanwha Resort, Room Monterosso, B1F


Title: Next Generation Terabyte/s HBM (High-bandwidth Memory Module) Designs for Advanced Artificial Intelligence (AI) Servers

Prof. Joungho Kim
KAIST(Korea Advanced Institute of Science and Technology), Korea
Keynote Speaker
November 4, Thursday | 11:05~11:35 P.M.
Hanwha Resort, Room Monterosso, B1F


Title: Warpage after molding processes: Can we really predict this?

Prof. Bongtae Han
University of Maryland, USA
November 4, Thursday | 11:35~12:05 P.M.
Hanwha Resort, Room Monterosso, B1F


Title: Advanced Packaging Technology & Materials trends

Dr. Santosh KUMAR
Yole Developement, France
  • Retirement Ceremony of Professor Kyung W. Paik
    November 4, Thursday | 5:25~5:40 P.M., Room Monterosso, B1F
  • Award Ceremony, Lucky Draw and Closing Remark
    November 5, Friday | 6:00~6:20 P.M., Room Monterosso, B1F

Sponsored by
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Recruitment Booth

The Korean Microelectronics and Packaging Society
4F, 74, Dongjak-daero, Seocho-gu, Seoul, 06676, Korea
Tel.: +82-2-538-0962, E-mail : kmeps@ismp2021.org