- Track 1
- November 4, Thursday | 8:30A.M.~5:25 P.M., Room Monterosso, B1F
- Track 2
- November 4, Thursday | 8:30 A.M.~5:25 P.M., Room Forum1, 3F
- Track 1
- November 5, Friday | 8:30A.M.~6:00 P.M., Room Monterosso, B1F
- Track 2
- November 5, Friday | 8:30 A.M.~6:00 P.M., Room Forum1, 3FF
Plenary Speaker
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November 4, Thursday | 1:20~1:50 P.M. Hanwha Resort, Room Monterosso, B1F Title: Semiconductor Industry Savior: Further Acceleration in Package Innovation Dr. Yun Tae Lee, Former CEO Samsung Electro-Mechanics Co., Ltd., Korea |
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November 4, Thursday | 1:50~2:20 P.M. Hanwha Resort, Room Monterosso, B1F Title: Next Generation Terabyte/s HBM (High-bandwidth Memory Module) Designs for Advanced Artificial Intelligence (AI) Servers Prof. Joungho Kim KAIST(Korea Advanced Institute of Science and Technology), Korea |
Keynote Speaker
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November 4, Thursday | 11:05~11:35 P.M. Hanwha Resort, Room Monterosso, B1F Title: Warpage after molding processes: Can we really predict this? Prof. Bongtae Han University of Maryland, USA |
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November 4, Thursday | 11:35~12:05 P.M. Hanwha Resort, Room Monterosso, B1F Title: Advanced Packaging Technology & Materials trends Dr. Santosh KUMAR Yole Developement, France |
- Retirement Ceremony of Professor Kyung W. Paik
November 4, Thursday | 5:25~5:40 P.M., Room Monterosso, B1F
- Award Ceremony, Lucky Draw and Closing Remark
November 5, Friday | 6:00~6:20 P.M., Room Monterosso, B1F
Sponsored by
| Diamond |
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| Platinum |
| Gold |
| Silver |
| Recruitment Booth |
